Product Name: Polyimide Resin
Item No.: SolverPI-Resin 70SY2
SolverPI-Resin 70SY2 is a high-performance IC package substrate used phosphorus-modified polyimide resin, BT resin system can replace.
SolverPI-Resin 70SY2 is based on bismaleimide-based polyimide value system, in other chemical composition does not contain DDM and other components, in line with environmental protection requirements.
l High glass transition temperature and thermal stability;
l Excellent solvent resistance;
l Low coefficient of thermal expansion (CTE, T-axis);
l High copper peel strength; good storage stability;
l Appearance: reddish brown liquid;
l Solid content: 50-70%;
l Gel time (171 ℃): 200-600 seconds;
CCL performance indicators
l The glass transition temperature (Tg): ≥200 ℃;
l Flame retardancy (UL-94): VO;
l Copper foil peeling strength (ibs / in): ≥7;