SolverPI-Resin 7002

SolverPI-Resin 7002
Product Details

Product Name: Polyimide Resin

Item No.: SolverPI-Resin 7002

SolverPI-Resin 7002 polyimide resin is one of the advanced composite matrix resin varieties, widely used in the manufacture of high performance composite materials, it can replace Kerimid601 polyimide resin. Mainly used (diamond, cubic boron nitride) grinding wheel and the friction material binder and refractory molded product matrix resin has excellent heat resistance and mechanical properties, but also suitable for the preparation of high resistance (low) temperature solid self lubricated mechanical parts. Available organic solvent (DMF etc.) was dissolved to prepare a resin solution of a certain solids content, for the preparation of fibers (glass fiber, carbon fiber, etc.) reinforced prepreg, in the field of high temperature resin based composite materials widely applied.

Characteristics

High glass transition temperature and thermal stability;

Excellent mechanical and electrical properties and mechanical properties;

Good storage stability.

Use of the product

After uniformly mixed with various powder, under certain molding conditions.

Dissolution with an organic solvent (DMF, etc.), a resin solution made by certain solids, for the preparation of fibers (glass fiber, carbon fiber, etc.) reinforced prepregs, laminates for use.

Carried out with an organic solvent (DMF etc.) was dissolved to prepare a resin solution certain solids, according to need different proportions of the epoxy resin blends can be prepared by a variety of heat-resistant grade of the new epoxy resin system to meet different composite materials and electrical insulation materials for epoxy resin heat resistance requirements.

Superhard abrasive used in the pressing process

1. the product uses thermoforming, pressing temperature: 220 ~ 230 . Pressing pressure: 15 ~ 25MPa. Pressing time with the thickness of the article may be. Specific parameters as follows:

Thickness(mm)

10

20

25

25

Pressing time(min)

40

50

90

100

2. the secondary curing temperature curve: oven temperature at 200 before freedom; incubated for 1 hour was raised to 200 ; incubated for 1 hour then warmed to 220 ; then warmed to 230-240 incubated for 4-5 hours; final etc. when the oven temperature drops below 100 to remove products.

Quality Index

Exterior

Melting point

granularity

fluidity

Gel time

Pale yellow powder

80-100

200-1000 h

8-20mm

100-600 s

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