SolverPI-Powder 1600X

SolverPI-Powder 1600X
Product Details

Product Name: Thermoplastic Polyimide Moulding Powder

Item No.: SolverPI-Powder 1600X

Mesh size: ≥800 Mesh

SPECIFICATIONS:

Properties

Testing Method

Unit

Value

Basic performance

Appearance

/

/

Light Yellow

Linear expansion coefficient of

(23-30℃)

GB/T 1036-1989

1/℃

3.68*10-5

Density(25℃)

/

g/cm3

1.38

Intrinsic viscosity

Q/HSMT

dL/g

0.5-0.8

Rockwell hardness

(m)

GB/T 3398.2-2008

/

110

Oxygen index

GB/T 2406.2-2009

%

46

The vertical combustion

GB/T 2408-2008

level

V-0

Mechanical properties of

The tensile strength

GB/T 1040.2/1A-2006

MPa

108

Elongation at break

GB/T 1040.2-2006

%

15

The impact strength

 (no gap)

GB/ 1043.1/1eU-2008

KJ/m2

244

The bending strength

GB/T 9341-2008

MPa

135

The compression strength

GB/ T 1041-2008

MPa

136

The coefficient of friction

GB/T 3960-1983(1989)

/

0.43

Thermal performance

The thermal deformation temperature(1.80MPa)

GB/T 1634.2-2004

250

Glass transition temperature (nitrogen atmosphere)

GB/T 19466.2-2009

260

Electrical properties

Dielectric strength

GB/T 1408.1-2006

MV/m

16.3

Volume resistivity

GB/T1410-2006

Ω·m

2.0*1014

 Definition: A high molecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphous resin, the products made from thermoplastic PI is amber and transparent.

 Main Characteristics:

l         Creep resistance, radiation resistance, good wave penetrating ability;

l         Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;

l         Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

In a word, SOLVER Thermoplastic Polyimide Moulding Powder (SolverPI-Powder1600) can completely replace Mitsui AURUM.

Advantages when compared with other special engineering plastics:

1. Compared with PEEK\PPS, thermoplastic PI is a non crystalline, showing better stability of mechanical properties and size at high temperature condition. While the crystalline plastic will continue to crystallization or crystallization damage when using the temperature between Tg and Tm, causing the mechanical changes and decreasing dimensional stability, creep resistance reducing.

2. Compared with PTFE, better dimensional stability, better creep resistance and high strength, the shortage is worse corrosion resistance.

3. Stabler performance in the high or low temperature performance. The processing temperature can be 340-380 , lower than Aurum. It no need heat treatment after the molding process.

4. Thermal properties: Tg:260 , HDT:250 , long-term use temperature is 240 . At the same time, also has very good performance of low temperature resistant, will not brittle fracture at the temperature of -269 in liquid nitrogen.

 Compared with BMI

The performance of BMI is more brittle, it will break off during the use of process.

SolverPI-Powder 1600X is showing as melting state during thermoplastic molding, the adhesion and toughness is better then not easier to be cracked.

Usage life is longer. BMI can be used for 4 hours, while SolverPI-Powder 1600X can be used continuously for 72 hours.

Using temperature can be higher. SolverPI-Powder 1600X can keep stable within 240

In the high-end abrasive in German are using polyimide as binder.

Application:

Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc.

The demand of high grade diamond abrasive for thermoplastic PI is big because the traditional adhesives can not meet their requiremen

Finished Samples:


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