SolverPI-Powder 1600

SolverPI-Powder 1600
Product Details

Product Name: Thermoplastic Polyimide Moulding Powder

Item No.: SolverPI-Powder 1600

Mesh size: ≥200 Mesh

SPECIFICATIONS:

Properties

Testing Method

Unit

Value

Basic performance

Appearance

/

/

Light Yellow

Linear expansion coefficient of

(23-30℃)

GB/T 1036-1989

1/℃

3.68*10-5

Density(25℃)

/

g/cm3

1.38

Intrinsic viscosity

Q/HSMT

dL/g

0.5-0.8

Rockwell hardness

(m)

GB/T 3398.2-2008

/

110

Oxygen index

GB/T 2406.2-2009

%

46

The vertical combustion

GB/T 2408-2008

level

V-0

Mechanical properties of

The tensile strength

GB/T 1040.2/1A-2006

MPa

108

Elongation at break

GB/T 1040.2-2006

%

15

The impact strength

 (no gap)

GB/ 1043.1/1eU-2008

KJ/m2

244

The bending strength

GB/T 9341-2008

MPa

135

The compression strength

GB/ T 1041-2008

MPa

136

The coefficient of friction

GB/T 3960-1983(1989)

/

0.43

Thermal performance

The thermal deformation temperature(1.80MPa)

GB/T 1634.2-2004

250

Glass transition temperature (nitrogen atmosphere)

GB/T 19466.2-2009

260

Electrical properties

Dielectric strength

GB/T 1408.1-2006

MV/m

16.3

Volume resistivity

GB/T1410-2006

Ω·m

2.0*1014

 Definition: A high molecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphous resin, the products made from thermoplastic PI is amber and transparent.

 Main Characteristics:

l         Creep resistance, radiation resistance, good wave penetrating ability;

l         Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;

l         Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

 In a word, SOLVER Thermoplastic Polyimide Moulding Powder

(SolverPI-Powder 1600) can completely replace Mitsui AURUM.

Application:

Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc.

The demand of high grade diamond abrasive for thermoplastic PI is big because the traditional adhesives can not meet their requirements.

 Moulded Samples:

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