Product Name: Thermoplastic Polyimide Adhesive
(Specially for Copper Clad Laminate)
Item No.: SolverPI-Adhesive 1600
The flexible copper clad(FCCL)refers to the polyimide film flexible insulating material such as single-side or double-side, through a certain process, with copper foil adhesive formed by copper clad.
Flexible copper clad is widely used in aerospace equipment, navigation equipment, aircraft instrument, military
guidance system and mobile phones, digital cameras, digital cameras, automobile satellite direction positioning
device, liquid crystal TV, notebook computers and other electronic products. Due to the rapid development of
electronic technology, makes the production of flexible copper clad steady growth, the production scale expands
unceasingly, especially high performance polyimide film as the base material of the flexible copper clad, its demand
and growth trend is more prominent.
FCCL except possesses the advantages of thin, light and flexible, with polyimide basilemma FCCL, also has excellent
heat resistance, excellent electrical performance, thermal performance characteristics. Its low dielectric constant (Dk),
makes the transmission of electrical signals to get fast. Good thermal performance, can make the cooling of the
components easily. High glass transition temperature (Tg) components may be running at higher temperatures.
Because FCCL most of the products, is a continuous roll shape form provided to the user, therefore, USES the
FCCL printed circuit board production, continuous production and to realize the automation of FPC in the continuity
of FPC components on the surface of the installation.
Adhesive is three layer method is an important part of flexible copper clad, it directly affect the product performance
and quality of flexible copper clad. Currently used in flexible copper clad adhesive mainly include polyester adhesive,
acrylic adhesive, epoxy or modified epoxy adhesives, polyimide adhesives, pf - butyral type, etc.
SOLVER polyimide resin has the following features:
(1) Similar to a typical thermosetting resin liquid and can be molded, available similar general method for
processing and molding with epoxy resin.
(2) Has excellent high temperature resistance, radiation resistance, resistance to damp and hot, corrosion resistance,
and the characteristics of small thermal expansion coefficient.