Thermoplastic polyimide (TPI) is developed in the traditional thermosetting polyimide (PI), based on polyimide (PI) means a macromolecular main chain containing imino group of a miscellaneous category ring oligomers, is one of the best overall performance of organic polymer materials.
It has anti-corrosion, anti-fatigue, tamper-resistant, impact resistance, low density, low noise, long life and other characteristics and excellent high temperature performance (-269 ℃ ~ 280 ℃ long-term deformation); thermal decomposition temperature of up to 600 ℃, is one of the highest in the thermal stability of the polymer species to date.
Many high-tech fields have been widely used in aerospace, aviation, space, automotive, microelectronics, nanotechnology, LCD, membrane, laser, electrical appliances, medical equipment, food processing, known as "problem solver" and "gold plastic".
However, the high manufacturing cost and molding difficulties are the two key factors of its rapid development.
To overcome thermosetting PI insoluble, infusible, difficult molding defects and to maintain its good performance, the US General Electric Company (GE) in the early 1970s began the development of thermoplastic polyimide (TPI), implemented in 1982, commercialization, and first-to-market commodity grades of Ultem, is the world's production capacity reached 10,000 tons-class companies, ranking TPI pole position in the industry.