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Thermal Properties Of Polyimide - Inorganic Hybrid Materials

Oct 11, 2016

The thermal stability of polyimide-inorganic hybrid materials is generally higher than that of pure polymers. With the increase of SiO2 content, the decomposition temperature of polyimide increases. As the phase separation is improved, the thermal stability is improved. For TiO2 hybrids, however, the opposite is true.

The coefficient of thermal expansion of inorganic materials is usually low, so by hybridization can reduce the thermal expansion coefficient of polyimide. For example, as the SiO2 content increases, the thermal expansion coefficient of the hybrid decreases linearly. The thermal expansion coefficient of polyimide hybrids containing 2% mica can be reduced by 60%. However, contrary to the situation, such as the introduction of SiO2 aerogels polyimide, but the thermal expansion coefficient more than doubled. Polyimide-polysiloxane hybrids have a higher coefficient of thermal expansion than polyimides because of the higher coefficient of thermal expansion of the polysiloxane.