In microelectronic devices, circuits technology, with the development of highly integrated, ultra-fast,
ultra-high frequency integrated circuits and devices, the feature size of integrated circuits and
devices more sophisticated, processing size has entered deep submicron hundred Nano even
nanoscale. But to achieve this goal, we must of chemical materials used in semiconductor and
integrated circuit industries, such as photoresist (resist), high-purity reagents, specialty gases,
packaging materials and put forward higher requirements to keep pace or ahead of development.
Photoresist (resist) development, from the g-line ((436 nm) to i-line (365 nm), excimer laser beam
(KrF, 248 nm and ArF, 193 nm) and electron beams, x-rays ion beam and a series of novel
radiation-sensitive material development, focus on i-line electron beam chemically amplified resist.
Direction in the development of high-purity reagents, focusing apply to 0.2 ^ -0.6, Research and
Development Reagent of NaN technology, as well as to carry out the necessary super 0. 09-0. 2 5m Processing Technology Previous studies of net high purity reagents.
In specialty gases, will focus on resolving gas purification technology and packaging technology
of high purity or corrosive gases, increase environmentally sound development and production
of specialty gas species (eg, nitrogen trifluoride, tungsten hexafluoride, etc.), and vigorously
develop hybrid gas production (eg, fluorine nitrogen, helium, fluorine, hydrogen fluoride, etc.),
to improve the detection accuracy of the analysis.
In terms of packaging materials, from the development trend of the package is, CSP, BGA
(surface mount solder ball array formula) and wafer level packaging will be the most important
direction of development, especially the part of CPS and wafer package, will process consists
of individually packaged chips at wafer level, as were converted as wafer processing.