Product Name: Polyimide Resin
Item No.: SolverPI-Resin 70SY1
SolverPI-Resin 70SY1 is a high performance copper clad laminate used for the polyimide resin, polyimide alternative Kerimid 701 resin system.
SolverPI-Resin 70SY1 is based on bismaleimide-based polyimide value system, in other chemical composition does not contain DDM and other components, in line with environmental protection requirements
l High glass transition temperature and thermal stability;
l Excellent solvent resistance;
l Low coefficient of thermal expansion (CTE, T-axis);
l High copper peel strength;
l Good storage stability.
l Appearance: reddish brown liquid;
l Solid content: 50-70%;
l Gel time (171 ℃): 200-600 seconds
CCL performance indicators
l The glass transition temperature (Tg): ≥200 ℃;
l Flame retardancy (UL-94): VO;
l Copper foil peeling strength (ibs / in): ≥7