Often referred to as a silicon-containing polyimide polyimide siloxane, first appeared in the 1961 patent. Introducing siloxane chain link to the polyimide can bring good workability. Increase of metal, silicon, ITO, and the glass itself is read nodal, reduce stress, low dielectric constant, low water absorption, high resistance to atomic oxygen resistance, good gas permeability and solubility and the like. Used as a dielectric film and the etching barrier layer and the encapsulating material in the microelectronics industry. Also used for gas separation membranes and wire and cable insulation material.