To promote the development of the polyimide spaceflight and aviation, electronics / electrical and automotive industry development. Poly DuPont Co pioneered the development of all four formic acid imide film (Kapton) and the production of polystyrene four formic acid imide plastic (Vespel); the original Amoco (Amoco) company is developed with a polyimide insulation paint (AI);The original French Rhone - Planck company is the first successful development of Bismaleimide prepolymer, the polymer does not produce gas by-products in curing, easy processing molding; American GE company developed polyether imide (PEI), and realize the industrial production. In addition, Ube developed poly diphenyl tetramethyl polyimide films, there are considerable differences and the performance of the Kapton, especially linear expansion coefficient is small, suitable for copper coated film, as a board application prospect of flexible printed circuit is very broad, the market prospects. Now the polyimide has more than 20 varieties, the global demand of more than 20000 tons, output value of more than $200billion in direct.
In the PI plastic, Jiande City Solver Polyimide Co., Ltd. developed more varieties, there is:Anhydride type polyimide, bismaleimide resin polyimide matrix resin, PMR as advanced composite materials are increasingly being used for military aircraft, civil aircraft, satellite communication, sports equipment, vehicles and electrical industry. Composite BMI resin in China has very good application in the plane.
China has developed three phenyl ether two anhydride imide, biphenyl two anhydride polyimide, two benzophenone imine, trimellitic anhydride type two three anhydride polyimide, bisphenol A ether anhydride two amine products. But compared with foreign, our country polyimide resin and film production scale is small, the price and the cost is higher, the quality of the products also exist some problems. But in the product of raw materials, production and technology in China are four toluene and output has reached a considerable scale and standard. However, due to technical products in foreign high value-added downstream, being exported in large quantities, the profit space is very small. Low temperature thermoplastic polyimide materials and.
Beijing Aeronautical Manufacturing Technology Research Institute using phenyl ketone four formic acid anhydride (two BDTA), 4, 4- two amino two diphenyl methane (DDM) and anhydride terminated PI oligomers were synthesized with carbon fiber composite, autoclave molding and made of aviation engine by-pass, and has been applied in a variety of types of aircraft in the.
Jiande City Solver Polyimide Co., Ltd.A new kind of thermoplastic polyimide, which has excellent mechanical properties, heat resistance, and corrosion resistance, wear-resistant characteristics. To overcome the defects most polyimide dissolves, melting and processing difficulty, showing good hot workability, the molding, extrusion molding and injection method; composite and carbon fiber, glass fiber, PTFE, graphite, which can further improve the material tensile, self-lubricating and wear-resistant properties. In addition to the materials can also be made into a film, also can be molded into tubes and rods and precision parts with complex structure, such as gears, bearings, sealing ring and connector. Therefore, it can replace metal polyimide thermosetting resin, ceramic, and the difficulty of processing to a certain extent, is an ideal material for gear.
According to the analysis, USA polyetherimide (UItem) accounts for 70% of the total demand. Have a tendency, and polyether sulfone polyphenylene sulfide and other aromatic PI competition the properties and processing characteristics. Condensation type PI and addition type PI occupies 30% of the market. Poly (amide imide) and poly (ester imide) are thermoplastic PI, they compete with other polymers in the cable, enamel, PI also occupy a certain market in Industrial decorative paint market and the mould plastic resin parts.
In recent years, research of fluorine H abroad is very active, such as Vannucci developed fluorinated PI oligomer FMR- Ⅱ -50400 ℃ after curing, the Tg up to 371-385C. American NASA also developed fluorinated P thermal stability is excellent, the new material V-CAP and AFR-700, with a ratio of FMR- Ⅱ -50 better processing performance and toughness.
In recent years, research of fluorine H abroad is very active, such as Vannucci developed fluorinated PI oligomer FMR- II -50400 ℃ after curing, the Tg up to 371-385C. American NASA also developed fluorinated P thermal stability is excellent, the new material V-CAP and AFR-700, with a ratio of FMR- -50 better processing performance and toughness. II