The polyimide polymer adhesive aimed primarily at their bonding with polyimide and epoxy polymer adhesive. Especially for the manufacture of printed circuit boards, currently mainly use polyimide film by a layer of adhesive bonding the copper foil prepared. This requires gather good adhesive force between the polyimide film and adhesive peel strength therebetween requirements reach 10N / cm. The adhesive used has an epoxy or acrylic polymer, but since these adhesives having high heat resistance enough, often difficult to use at 70 ℃. So the more heat-resistant adhesives, especially polyimide-based adhesives have become increasingly urgent. Polymer adhesion to the polymer chains is achieved through the entanglement of macromolecules interface diffusion.
Determinants of polyimide polyimide bonding are: 1. polyamic acid diffusion through the interface. 2. The two films of the cured system. 3. After imidization molecular structure and aggregation at the interface