Condensation type polyimide molecular design and synthesis
Polyimide (PI) is required material aerospace industry development. DuPont in 1961 by the American company first launched.
Thermoplastic: polyamide - imide, polyimide
Non-thermoplastic: wholly aromatic polyimide
Aromatic polyimide is an important class of high-performance polymers, usually divided into two types: addition polymerization and condensation polyimide polyimide.
Addition polymerization type polyimide: bismaleimide type, norbornene terminated polyimide oligomers (such as NASA's PMR-15) and alkyne-terminated polyimide oligomer (such as the US Thermid series). Such polyimide brittle, but the cured resin as a substrate composite materials used in printed circuit boards, aircraft, cars, trains and offshore oil platforms.
Condensation type polyimide: aromatic dianhydride with an aromatic diamine or aliphatic diamine polycondensation (pyromellitic dianhydride and 4,4'-diaminodiphenyl ether condensation), the monomer wide range of options, according to the Some need to synthesize polymers having specific physical properties (such as Tg, Tm, toughness, modulus and thermal expansion coefficient, etc.). Uses: adhesives, fibers, membrane
Polyimide polymer compound is an aromatic heterocyclic molecular structure containing imide links, the English name Polyimide (referred to as PI), is one of the best varieties of heat resistant engineering plastics currently. PI as a special engineering materials, has been widely used in aviation, aerospace, microelectronics, nanotechnology, liquid separation membrane, such as a laser. Recently, countries in the PI's research, development and use of engineering plastics in the 21st century included in one of the most promising. Polyimide, its outstanding performance characteristics and synthesis, either as a structural material or as a functional material, and its potential application has been fully recognized, known as a "problem solver" ( protion solver), and that "there would be no polyimide today's microelectronics technology."