Electronic grade PI film applications in semiconductor and microelectronics industries mainly in the following aspects:
1. Particle blind film: With the increasing density of integrated circuits and chip size, the performance of anti-radiation is also more important. High purity polyimide coating film is an effective resistance and anti-radiation shielding material particles. Memory errors ray shielding layer passivation film coated components 50-100 housing units to prevent the release of trace amounts of uranium and oyster and other radiation caused. Of course, the content of the polyimide resin coating material containing uranium must be low, 256kDRAM resin content requirements for uranium is less than 0. 1ppb. Also, excellent mechanical properties of the polyimide can prevent die cracking in the subsequent encapsulation process.
2. Passivation layer and the buffer coating within a microelectronic device
Polyimide as a passivation layer and the buffer layer protection in the microelectronics industry is widely used. PU coating can effectively hinder electron mobility, prevent corrosion. PI layer protects the components having a low leakage current, increase the mechanical properties of the device, to prevent chemical corrosion, it can effectively increase the moisture resistance components. PI film has a buffer function, which can effectively reduce the circuit breaker to crack due to thermal stress caused by the reduction in component damage during subsequent processing, packaging and post-treatment process. Although the polyimide coating can effectively avoid cracking plastic devices, but is closely related to the performance of a polyimide material effects and uses. In general, having good adhesive properties, glass transition temperature is higher than the soldering temperature, low water absorption of the polyimide coating is desirable to prevent the material of the device cracked.
3.Multi-layer metal interconnect interlayer dielectric material circuit
Polyimide (PI film is mainly in the form of product) can be used as multi-layer wiring technology between the multilayer metal interconnect layers of dielectric material. Multilayer wiring technology is a key technology to develop and produce a three-dimensional structure of the interchange of high-density high-speed ultra-large-scale integrated circuits. Multi-layer metal interconnect on the chip can significantly reduce the density of connections between devices, reducing the RC time constant and chip footprint, greatly improve the speed of the integrated circuit, integration and reliability. Multi-layer metal interconnect technology and the commonly used aluminum oxide dielectric and metal interconnect different insulation technology, which mainly uses high-performance polyimide film material is a dielectric insulating layer, copper or aluminum wire interconnects using copper chemical mechanical polishing. The main advantage of this technique is to use a high-conductivity copper and resistance to electromigration resistance, low dielectric constant polyimide material, and planarization performance and good mappable performance.
4. Important Optical printed circuit board substrate
Light with high bandwidth, high-density, there is no electromagnetic interference (EMI) and other advantages, it is gradually replaced by a system for interconnecting electrical interconnection. Chip-to-chip optical interconnection technology between the PCB is electrically interconnected to solve these bottlenecks a very promising approach. One of photovoltaic printed circuit board (EOPCB), as the very future growth potential PCB products, The current development of very sophisticated printed circuit board with a layer of light guide layer, makes use of circuit board extending from the existing electrical connection technology to the field of optical transmission, This layer of the light guide layer material an ideal choice is to use a fluorine-containing polyimide film. The refractive index of the polyimide size by adjusting the amount of fluorine-containing copolymer, the higher the fluorine content, the smaller the refractive index of the fluorine-containing polyimide film, thereby adjusting the size of the refractive index, the waveguide core and cladding polyimide may be employed. Currently in Europe, America, Japan, have developed a kind of PI film, some have begun to use small quantities in the photo printed circuit board manufacturing.